Adaptive 3D-IC TSV Fault Tolerance Structure Generation
نویسندگان
چکیده
منابع مشابه
Adaptive 3D-IC TSV Fault Tolerance Structure Generation
In three dimensional integrated circuits (3D-ICs), through silicon via (TSV) is a critical technique in providing vertical connections. However, the yield and reliability is one of the key obstacles to adopt the TSV based 3D-ICs technology in industry. Various fault-tolerance structures using spare TSVs to repair faulty functional TSVs have been proposed in literature for yield and reliability ...
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this report shows the survey of reliability of 3D IC manufactory and its robustness. Firstly, we consider the reliability of the manufactory of 3D IC. The process-induced thermal stresses around TSVs raise serious reliability issues such as Si cracking and performance degradation of devices. Finite element analysis (FEA) combined with analytical methods is introduced to investigate this issue, ...
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Article history: Received 8 November 2015 Received in revised form 1 March 2016 Accepted 4 March 2016 Available online 5 March 2016 Although thermal-aware Through Silicon Via (TSV) cluster's behavior has been studied extensively, the structure of TSV cluster,which is also critical for heat dissipation in ThreeDimensional IntegratedCircuit (3D IC), is ignored. In this paper, a novel structure of...
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ژورنال
عنوان ژورنال: IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
سال: 2019
ISSN: 0278-0070,1937-4151
DOI: 10.1109/tcad.2018.2824284